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Large wafer surface contamination metrology by TXRF

Measurement of trace elemental surface contamination

  • Quick contamination inspection for semiconductor processes
  • Accepts 450 mm and 300 mm wafers
  • Wide range of analytical elements (Na~U)
  • Light-element sensitivity (for Na, Mg, and Al)
  • Single target 3-beam method and XYθ stage are unique to Rigaku, enabling highly accurate ultra trace analysis over the entire wafer surface
  • Import measurement coordinates from defect inspection tools for follow-up analysis
Semiconductors, Total reflection XRF (TXRF)
Semiconductor manufacturing
Total reflection X-ray fluorescence (TXRF)

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF-450 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system.

Rigaku TXRF-450 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation.

Optional Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision.

Optional ZEE-TXRF capability overcomes the historical 15mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion.

Optional BAC-TXRF capability enables fully-automated front-side and back-side TXRF measurements of 450mm wafers with non-contacting wafer flipping.


Product name TXRF-450
Technique Total reflection X-ray fluorescence (TXRF)
Benefit Trace elemental surface contamination on large (300 / 450 mm) wafers
Technology Three-beam excitation and automatic optics alignment
Core attributes Rotating-anode X-ray source, XYθ sample stage , liquid nitrogen-free detector, accepts 300 mm and  450 mm wafers
Core options GEM-300 automation software for full factory automation, SP-TXRF capability enables mapping of the entire wafer surface, ZEE-TXRF capability enables measurements to zero edge exclusion, BAC-TXRF capability enables fully-automated front-side and back-side measurements
Computer Internal PC, MS Windows® OS
Core dimensions n/a
Mass n/a (core unit)
Power requirements 3Ø, 200 VAC 50/60 Hz, 30 A