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Surface contamination metrology

Measure elemental contamination at discrete points or with full wafer maps

  • Ease of operation and rapid analysis results
  • Accepts 200 mm and smaller wafers
  • Compact design, footprint
  • High-power rotating-anode source
  • Wide range of analytical elements (Na~U)
  • Light-element sensitivity (for Na, Mg, and Al)
  • Application to bare Si and to non-Si substrates
  • Import measurement coordinates from defect inspection tools for follow-up analysis
TXRF 3760
Semiconductors, Total reflection XRF (TXRF)
Semiconductor manufacturing
Total reflection X-ray fluorescence (TXRF)

TXRF analysis can gauge contamination in all fab processes, including cleaning, litho, etch, ashing, films, etc. The TXRF 3760 can measure elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system.

The TXRF 3760 includes Rigaku's patented XYθ sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation.

Optional Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots" that can be automatically re-measured at higher precision. Optional ZEE-TXRF capability overcomes the historical 15 mm edge exclusion of original TXRF designs, enabling measurements to be made with zero edge exclusion.

Specifications

Product name TXRF 3760
Technique Total reflection X-ray fluorescence (TXRF)
Benefit Rapid elemental analysis, of Na to U,  to gauge wafer contamination in all fab processes
Technology 3-beam TXRF system with liquid nitrogen-free detector
Core attributes Up to 200 mm wafers, XYθ sample stage system, in-vacuum wafer robotic transfer system, ECS/GEM communication software
Core options Sweeping TXRF software enables mapping of the contaminant distribution over the wafer surface to identify "hot spots." ZEE-TXRF capability enabling measurements to be made with zero edge exclusion
Computer Internal PC, MS Windows® OS
Core dimensions 1000 (W) x 1760 (H) x 948 (D) mm
Mass 100 kg (core unit)
Power requirements 3Ø, 200 VAC 50/60 Hz, 100 A