Process XRR, XRF, and XRD metrology FAB tool
Thickness, density, roughness & composition of films on blanket and patterned wafers
- Micro-spot X-ray beams and pattern recognition
- High-throughput, product-wafer measurements
- Wide range of materials and applications
- High resolution and precision covering thicknesses from Ångstroms to microns
- For 200 mm and 300 mm wafers
- Available with 300 mm factory automation
- Design based on SEMI S2 and SEMI S8
The Rigaku MFM310 performs high-precision measurements not possible by optical or ultrasonic techniques. This sophisticated X-ray metrology tool makes it practical to perform high-throughput measurements on product and blanket wafers ranging from ultrathin single-layer films to multilayer stacks.
Designed for high-volume manufacturing
The MFM310 is designed with high-volume 200 mm and 300 mm manufacturing in mind: high-throughput thickness measurement by XRR and XRF, low-contamination wafer handling and pattern recognition-based position control for product wafer measurements, CE Marking and S2/S8 Compliance for semiconductor production clean room operation, compliance with GEM-300/HSMS and factory automation standards, high-reliability machine performance and low power consumption and cost of ownership.
COLORS™ enabling technology
COLORS™ X-ray optics were developed by Rigaku for the MFM310 to enable measurements from small areas. COLORS beam modules couple a variety of XRF excitation sources with optics and are optimized to provide high brightness in small spots for a variety of thin film applications. With its own x-ray optics business, Rigaku is well-positioned develop and manufacture X-ray sources for current and future market needs.
|Technique||X-ray reflectivity, fluorescence and diffraction|
|Benefit||Measure ultra-thin single-layer films to multi-layer stacks|
|Technology||Process micro-spot XRR, XRF, XRD with 2 FOUP load ports|
|Core attributes||CE marked, S2 / S8 / GEM-300 / HSMS compliance|
|Core options||Available with 300 mm factory automation|
|Computer||Internal PC, MS Windows® OS|
|Core dimensions||1400 (W) x 2050 (H) x 3410 (D) mm|
|Mass||n/a (core unit)|
|Power requirements||3Ø, 208 VAC 50/60 Hz, 2.5 kW|