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Semiconductors

Film thickness/composition and wafer contamination tools

Rigaku is a pioneer and world leader in designing and manufacturing X-ray based measurement tools to solve semiconductor manufacturing challenges. With over 35 years of global market leadership in the semiconductor industry, our families of products enable everything from in-fab process control metrology to R&D for thin film and materials characterization. Our XRF, XRD and XRR metrology tools measure critical process parameters like thin film: thickness, composition, roughness, density, porosity, and crystal structure. In addition, we offer process TXRF and VPD-TXRF tools for contamination measurement. With global 24/7 service and support, Rigaku delivers cutting-edge solutions for yield enhancement and process development.

The semiconductor industry is the aggregate collection of companies engaged in the design and fabrication of semiconductor devices. It formed around 1960, once the fabrication of semiconductors became a viable business.

Semiconductors

Rigaku recommends the following systems:


  • Advanced state-of-the-art high-resolution XRD system powered by Guidance expert system software

  • WDXRF spectrometer designed to handle very large and/or heavy samples

  • A fast, high-resolution laboratory X-ray topography system for non-destructive dislocation imaging

  • In-line, simultaneous WDXRF spectrometer for wafer metal film metrology; up to 300 mm wafers

  • Simultaneous WDXRF spectrometer for wafer metal film metrology; up to 200 mm wafers

  • Sequential WDXRF spectrometer for elemental analysis and thin-film metrology of large and/or heavy samples

  • Process XRR, XRF, and XRD metrology tool for blanket and patterned wafers; up to 300 mm wafers

  • Trace elemental surface contamination metrology by TXRF; up to 200 mm wafers.

  • Trace elemental surface contamination metrology by TXRF; up to 200 mm wafers.

  • Trace elemental surface contamination metrology by TXRF; up to 300 mm wafers

  • Ultra-trace elemental surface contamination metrology by TXRF with VPD capability; up to 300 mm wafers

  • High-resolution benchtop microtomography of large samples

Application notes

The following application notes are relevant to this industry